Thermo Compression Bonding: The advancement and innovation of miniature medical devices have revolutionized the medical sector, especially in creating non-invasive equipment used in the medical field. Non-invasive equipment has played an integral role in swaying away from invasive procedures that required the use of more invasive devices. Such devices required the use of operative procedures. The drawbacks of invasive procedures include disruption of other body functions, cost implication, and longer healing periods among others.
The invention of miniature devices like biomedical sensor has played a major role in actualizing non-invasive procedures in the health care industry. However, with its conception, it has solicited challenges that have made the manufacture and deployment of miniature devices for medical procedures intolerable. The phenomenon has led to the undermining of progress made in the health sector through the miniaturization of devices.
Challenges in Miniaturization
A larger portion of the challenges faced is by the manufacture of the miniature components in terms of design and functionality. Understanding challenges vests upon the comprehension of miniature devices. The challenges presented to the designer in the manufacture of components include connecting the different components and creating an operating system that functions as the interface for the miniature devices.
The primary focus in on the components itself, which draws attention to miniature electromagnetic coils as one of the components that have made it possible for miniature devices creation and connection with one another. The coils cannot wind by the normal coiling machine because of the fineness of the wires. Connecting the microwires to different components in the devices through soldering was unattainable, hence introducing thermo compression bonding.
Why Thermo Compression Bonding?
The inadequacies presented by traditional-based soldering connections brought about the invention of alternative ways to make micro-wire connections for miniature medical devices. Heat soldering solutions presented the following challenges:
- Oxidation of the wire connection and its immediate environs, which downplayed the efficiency and effectiveness by resulting in inferior conductivity and low durability in the medical device.
- Excess strain resulting in the degraded durability of the component.
- Heat damage to the area soldered resulting in degraded connection durability and reliability.
The thermo compression bondingtechnology allows the connection of ultra-fine wires at any serially manufactured diameters to other ultra-fine wires of similar diameter or other wires 12 times as thick.
The technology leads to a molecular bond between the two components being fused by thermo pressure. The bond provides such a connection with highly reliable, rust-free, and no strain connectivity, therefore, lowering manufacturing costs and simplifying the manufacturing process.